bonding machine
英 [ˈbɒndɪŋ məˈʃiːn]
美 [ˈbɑːndɪŋ məˈʃiːn]
网络 胶合机; 结合机; 求购焊接机; 焊接机
双语例句
- Prediction of Disulfide Bonding in Protein Structure Based on Support Vector Machine Tangential keys and keyways
支持向量机方法预测蛋白质结构中的二硫键GB/T1974-1980切向键及其键槽 - Microleakage evaluation of the use of different bonding agents before fissure sealing jar-filling, closing, sealing or labelling machine, industrial
粘接剂对窝沟封闭剂边缘密合性影响的实验研究广口瓶装填、封口、密封或粘标签的机器、工业用 - Design of control system for the tape automatic bonding machine Based on PLC
基于PLC的TAB绑定机控制系统设计 - Rubber bonding agent used mainly on the roller grinding machine mixing, and roll into thin slices, then use the red knife punching molding;
橡胶结合剂磨具主要采用对辊机混料，并滚压成薄片，然后用冲刀冲裁成型； - Design of welding pressure control system for ultrasonic gold wire bonding machine
超声波金丝球焊线机焊接压力控制系统设计 - The Design of Temperature Control Scheme for ABD-100 ACF Bonding Machine
ABD-100ACF邦定机温度控制方案的设计 - Application of Vision System and The Study of Contraposition Arithmetic of Flip Chip Bonding Machine
倒装焊机中视觉系统的应用及对位算法研究 - Anodic bonding applied in the joining of solid electrolyte borosilicate glass and silicon is achieved with bonding machine in the assistance of static electric field.
固体电解质（玻璃）与硅片通过阳极连接可以实现良好键合。 - Analyse the application of visual system in COG bonding machine.
针对视觉系统在全自动COG热压焊机中的应用进行分析。 - In order to enhance the welding speed of microcircuit chips, the control software algorithm for the bonding machine was optimized.
为了提高生产微电路芯片的焊接速度，我们对超声波焊接机工业控制软件的算法进行部分优化。 - Development of Control System Used in Ultrasonic Al Wire Bonding Machine
超声波铝线自动邦定机控制系统的研制 - The control software for ultrasonic bonding machine is indispensable for the automatic production-lines run by manufactories making microcircuit chips.
超声波焊接机控制软件是国内外生产微电路芯片厂家自动化流水线的不可缺少的一部分。 - The paper takes the IC-encapsulation equipment& semi-automatic ultrasonic wire bonding machine as the control object.
论文正是以IC封装设备&半自动超声波焊线机为控制对象。 - The Choosing Method For Die Bonding Machine
芯片粘接设备的选择策略 - The automatic position alignment system for the ultrasonic wire bonding machine
超声压焊机自动位置对准系统 - To ensure the machining precision or the stability of the feeding servo system, the bonding structures between shaft and hub should adopt the improved keys and pins or adopt the interference fit and close fit in the feeding mechanisms of numerical control machine tools.
为保证加工精度或进给伺服系统的稳定性，数控机床进给传动机构的轴、毂联接应采用改进的键、销联接结构或过盈、胀紧联接结构。 - Analysis on the Thermal-stain of Press Part on COG Bonding Machine with ANSYS
基于ANSYS的COG邦定机压头热应变分析 - This thesis is devoted to the orientation and the detection of the HDD slider when bonded in SBB ( solder ball bonding) machine.
本文主要研究SBB（solderballbonding）机器中硬盘磁头焊接时的定位和检测。 - The article presents advantages of the dry heat technology, adhesives available, benefits of low temperature bonding and important parts in a laminating machine.
本文介绍了干热层合技术的优点，可供使用的粘合剂、低温粘合的优点及层合机的组成。 - The bonding machine has five axes, and each axis is driven by one stepping motor.
焊线机是由五个轴的执行机构组成，每个轴都是由一个步进电机驱动。 - Transformation superplastic diffusion bonding ( TSDB) of A3 steels and stainless steels has been studied by mains of vacuum diffusion bonding equipment, electron mechanical universal material testing machine.
通过利用真空扩散焊设备，成功地进行了钢与不锈钢相变超塑扩散连接。 - Wafer Quality Detecting System of Automatic Die Bonding Machine
全自动上芯机的晶片检测系统 - Bonding repairing application in conveying pipe of pneumatic hoisting machine
空气提升机输料管粘接修补应用 - With the development of the integrated circuit industry, the welding speed and welding line quality of the wire bonding machine appear new demands and challenges.
随着集成电路行业的发展，对引线键合机的焊线速度和质量提出了新的要求和挑战。 - The research results of this paper have a guiding significance for studying the bonding technology of the cutterhead of shield machine.
论文研究结果对开展盾构机刀盘的焊接工艺的研究具有一定的指导意义。 - In order to reduce the cost, shorten the research time and improve the efficiency, MSC software could be utilized to build up a prototype, meanwhile some external factors that affect the performance of the wire bonding machine should be identified to make the simulation more accurate.
为节约开发成本，缩短开发时间，提高效率，可以利用MSC系列软件可以建立虚拟样机模型，为提高仿真效果，必须对一些影响键合机工作性能的外界干扰因素，进行建模分析。 - With the requirements of high accuracy and high speed in wire bonding, machine vision positioning system has become one of important factors which influence the quality of IC packaging.
随着引线键合技术向着细密化、高精度的方向发展，视觉系统已经成为影响IC封装精度的重要因素之一。 - With the rapid development of LED industry, it requires better performance of semiconductor-sealing-packing equipment. It is key factor that serviceability of ultrasonic transducer used on bonding machine is good or bad.
随着LED行业的快速发展，对半导体后封装设备的性能也提出了越来越高的要求，用于半导体后封装中引线键合机的超声键合系统的工作性能成了关键因素之一。